The engineers designing the silicon, the packaging, and the boards that everything else runs on.
10 roles match your filters
An AI hardware startup with a shipping product and designing the next-generation architecture.
A communications equipment manufacturer building high-throughput signal processing systems on large-scale FPGA platforms.
A semiconductor manufacturer ramping a new advanced-node fab with 300mm wafer production in the US.
Semiconductor company developing chiplet-based architectures for high-performance computing. The next-generation HPC product uses 3D-stacked chiplets with hybrid bonding at leading-edge pitch.
Server hardware company designing high-performance compute platforms for data centers and HPC clusters, shipping custom server boards to cloud providers and national labs.
Fabless chip company designing networking ASICs for cloud data center switches. The current generation handles industry-standard switching capacity and the next generation targets a significant throughput increase.
Automotive semiconductor company producing ADAS and powertrain chips for the top 5 global automakers, shipping 200M+ chips per year with zero-defect quality targets.
A fabless chip company designing custom SoCs at an advanced node and taping out on a leading foundry process.
An established, publicly traded analog semiconductor company with a Boston-area mixed-signal design center, shipping precision sensing and signal-chain ICs into industrial and automotive markets.
An ASIC design-services firm executing block-level physical design and timing closure for fabless clients taping out at advanced nodes.
