Senior ASIC Design Engineer, AI Accelerator
An AI hardware startup with a shipping product and designing the next-generation architecture.
A communications equipment manufacturer building high-throughput signal processing systems on large-scale FPGA platforms.
Eight FPGA engineers and three DSP algorithm designers. Chief Architect is the direct report.
The next-gen receiver needs to process multi-tens-of-Gbps downlink data in real time using Xilinx Versal ACAP devices. The current architecture falls short of the throughput target.
FPGA architecture for high-throughput signal processing in communication systems. Defining the signal processing pipeline, designing RTL modules, and driving implementation through timing closure on Versal ACAP devices where every nanosecond of pipeline latency matters.
An AI hardware startup with a shipping product and designing the next-generation architecture.
A semiconductor manufacturer ramping a new advanced-node fab with 300mm wafer production in the US.
Semiconductor company developing chiplet-based architectures for high-performance computing. The next-generation HPC product uses 3D-stacked chiplets with hybrid bonding at leading-edge pitch.
Principal FPGA Architect, High-Speed Data Processing
$200K - $235K base