Principal FPGA Architect, High-Speed Data Processing
A communications equipment manufacturer building high-throughput signal processing systems on large-scale FPGA platforms.
An AI hardware startup with a shipping product and designing the next-generation architecture.
Twelve RTL designers and four verification engineers. Director of Chip Design is the direct report.
The third-gen chip needs 100 TOPS at under 15W. The second-gen datapath was designed for CNNs. Transformer workloads have fundamentally different memory access patterns and the current architecture leaves 40% of the MAC array idle during attention computations. The datapath needs a ground-up redesign.
RTL design for the compute datapath of an AI inference accelerator. MAC arrays, on-chip memory hierarchy, and the data movement architecture that determines whether the chip hits its TOPS/W target or misses it. The decisions made in this role show up directly in the product's power and performance spec sheet -- and in customer benchmarks against the competition.
A communications equipment manufacturer building high-throughput signal processing systems on large-scale FPGA platforms.
A semiconductor manufacturer ramping a new advanced-node fab with 300mm wafer production in the US.
Semiconductor company developing chiplet-based architectures for high-performance computing. The next-generation HPC product uses 3D-stacked chiplets with hybrid bonding at leading-edge pitch.
Senior ASIC Design Engineer, AI Accelerator
$175K - $220K base