Staff Packaging Engineer, Advanced 3D Integration

The challenge

Hybrid bonding at leading-edge pitch is producing yield loss from bonding voids. Developing the process and inspection methodology to bring this below production thresholds.

Role overview

You lead the development of advanced packaging technologies for chiplet-based products. Process development, reliability testing, and design rule definition enabling next-generation 3D integration -- the work that determines whether chiplet architectures deliver on their performance-per-watt promises.

Specializations

Technical requirements

• PhD in Materials Science, Mechanical Engineering, or Electrical Engineering with packaging focus
• 12+ years in semiconductor packaging, with 5+ years on advanced packaging technologies (2.5D/3D, chiplets)
• Experience with hybrid bonding, micro-bump, or copper pillar interconnect technologies
• Understanding of package thermal analysis tools (ANSYS Icepak, FloTHERM, or equivalent)
• Experience with reliability testing and failure analysis for flip-chip and stacked packages
• Track record of taking packaging technologies from development through production qualification

Key responsibilities

• Develop and qualify hybrid bonding processes for chiplet-to-interposer integration at leading-edge pitch
• Define packaging design rules and constraints for chiplet-based products
• Lead thermal characterization and thermal management design for 3D-stacked packages exceeding 500W TDP
• Develop reliability test plans per JEDEC standards (JESD22 series) and automotive AEC-Q100 where applicable
• Drive yield improvement programs for advanced packaging processes
• Evaluate and qualify packaging materials (underfill, TIM, substrates) from vendor qualification through production

Compensation & Benefits

• Base salary: $260,000 - $305,000
• RSU grant with annual refresh
• Annual bonus 15-20%
• On-site childcare and gym
• Generous relocation package