TechElites

Packaging & Test engineer jobs

Packaging & Test engineering. Salary on every listing.

Salary range

$175K - $305K

Cities

San Francisco Bay Area, Austin

Seniority

staff, principal

$260K - $305KPublic Tech

Staff Packaging Engineer, Advanced 3D Integration

Semiconductor company developing chiplet-based architectures for high-performance computing. The next-generation HPC product uses 3D-stacked chiplets with hybrid bonding at leading-edge pitch.

San Francisco Bay Area·on-site·full-time
Semiconductor & Hardware EngineeringPackaging & Test
$175K - $210KIndustrial

Principal Test Engineer, Automotive Semiconductor

Automotive semiconductor company producing ADAS and powertrain chips for the top 5 global automakers, shipping 200M+ chips per year with zero-defect quality targets.

Austin·on-site·full-time
Semiconductor & Hardware EngineeringPackaging & Test

Related role families in semiconductor & hardware engineering

ASIC & Chip DesignFPGA ArchitectureFab Process EngineeringPCB & Board Design
All semiconductor & hardware engineering jobsSemiconductor & Hardware Engineering careers overviewAll engineering jobs